Type of packaging | Box |
Connection | PCI-E x16 3.0 |
Form Factor | ATX |
The maximum resolution of the video card | 7680 x 4320 |
Type of memory | GDDR5 |
Memory | 6 GB |
The GPU operating frequency | 1800 MHz |
1785 MHz /(Reference Card) | |
Memory bus | 192 bit |
Maximum resolution | 7680x4320 |
Graphics Card Type | Game |
Type of packaging | Box |
Connection | PCI-E x16 3.0 |
Form Factor | ATX |
Maximum connected monitors | 4 |
The maximum resolution of the video card | 7680 x 4320 |
Type of memory | GDDR5 |
Memory | 6 GB |
The GPU operating frequency | 1800 MHz |
1785 MHz /(Reference Card) | |
Memory bus | 192 bit |
Number of CUDA Cores | 1408 |
Maximum resolution | 7680x4320 |
HDMI port | 1 pcs (2.0b ) |
Ports DisplayPort | 3 pcs (1.4) |
External power connector | 1 x 8-pin |
DirectX version | 12 |
OpenGL version | 4.6 |
Recommended power supply unit power, W | 450 |
The length of the video card | 170 mm |
გარანტია | 36 თვე |
GIGABYTE Custom-designed cooling system features a 90mm unique blade fan, a copper composite heat-pipe with direct touch GPU and 3D active fan functionality, together delivering an effective heat dissipation capacity for higher performance at lower temperatures.
With less than 170mm in length, the graphics card can be easily installed in any small chassis.
The airflow is spilt by the triangular fan edge, and guided smoothly through the 3D stripe curve on the fan surface, effectively enhancing the airflow.
The 3D Active Fan provides semi-passive cooling, and the fans will remain off when the GPU is in a low load or low power game. It allows gamers to enjoy gameplay in complete silence when the system is running light or idle.
The shape of the pure copper heat pipe maximizes the direct contact area with the GPU, enhancing heat transfer. The heat pipe also covers the VRAM through a large metal plate contact to ensure proper cooling.
The composite heat-pipe combines thermal conductivity and phase transition to efficiently manage the heat transfer between two solid interfaces which increase cooling capacity.
Lower RDS(on) MOSFETs are specially designed to produce lower switching resistance for faster electric current charging and discharging at extremely low temperature.
Metal Choke hold energy much longer than common iron-core chokes at high frequency, thus effectively reduce core energy loss and EMI interference.
Lower ESR Solid Capacitors ensure better electronic conductivity for excellent system performance and longer lifespan.
The actual software UI and functionalities depend on each device model.