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Cooler Master CPU cooler Hyper 212 EVO V2, LGA1700, 1200, 115x, 2066, AM4, 4pin PWM, TDP 150W
| Appointment | for processor |
| A type | Active cooler |
| The fans | 1 pcs |
| Heatsink Material | Aluminum/copper |
| Processor compatibility | LGA1155/1156 |
| LGA2011 | |
| FM1 | |
| AM3+ | |
| AM3 | |
| AM2 | |
| LGA1150 | |
| FM2 | |
| AM2+ | |
| FM2+ | |
| LGA2011-3 | |
| LGA1151 | |
| AM4 | |
| LGA2066 | |
| LGA1200 | |
| LGA1700 | |
| Fan diameter mm | 120 |
| Maximum speed, rev / min | 1800 |
| Max. air flow | 62 CFM |
| The maximum TDP | 150 W |
| Noise level | 27 dB |
| Socket | 4-pin |
| Dimensions | 120 x 80 x 154 mm |
| The weight | 780 g |
| Appointment | for processor |
| A type | Active cooler |
| The fans | 1 pcs |
| Heat pipes | 4 pcs |
| Heatsink Material | Aluminum/copper |
| Processor compatibility | LGA1155/1156 |
| LGA2011 | |
| FM1 | |
| AM3+ | |
| AM3 | |
| AM2 | |
| LGA1150 | |
| FM2 | |
| AM2+ | |
| FM2+ | |
| LGA2011-3 | |
| LGA1151 | |
| AM4 | |
| LGA2066 | |
| LGA1200 | |
| LGA1700 |
| Fan diameter mm | 120 |
| Maximum speed, rev / min | 1800 |
| Max. air flow | 62 CFM |
| The maximum TDP | 150 W |
| Rated voltage | 0.15 V |
| Air pressure | 2.52 mm |
| Noise level | 27 dB |
| Power consumption | 1.8 W |
| Socket | 4-pin |
| Dimensions | 120 x 80 x 154 mm |
| Height | 155 mm |
| Colour | black |
| grey | |
| The weight | 780 g |
| სიგანე | 160 მილიმეტრი |
| სიმაღლე | 230 მილიმეტრი |
| სიგრძე | 100 მილიმეტრი |
| წონა | 1.00 კგ |
| მოცულობა | 0.0037 მ3 |
| გარანტია | 24 თვე |
ჩვენ მოგწერთ ელ.ფოსტაზე, როგორც კი პროდუქცია იქნება გაყიდვაში!
The asymmetrical heat pipe design ensures RAM compatibility and clearance space
Low heatsinks for better chassis clearance
X-VENTS DESIGN
Positioned in a 45-degree angle and surrounding the heatpipe, each fin-blade features X-shaped vents that create areas of high and low air pressure, resulting in several controlled vortices. These small and chaotic turbulences produce strong gusts that reduce overall airflow but improve airflow where it matters the most - next to the heatpipes
DIRECT CONTACT TECHNOLOGY
4 heatpipes with Direct Contact Technology creates a sleek contact surface area for maximize heat dissipation
SICKLEFLOW 120 FAN
Newly Optimized blade design with updated curve that provides best balance between airflow and static pressure to take the heat away while remain extremely silence.
QUIET OPERATION
Low vibrations and quiet fan allows for nearly inaudible levels. More than 10% decreased of fan noise level from previous model.
EASY INSTALLATION
Tool-free mounting system ensures hassle-free installation. Universal retention brackets are compatible with latest Intel and AMD socket CPU.