მთავარი - Consumer Goods & Electronics - Electronics, computers and office - Computer components - Cooling systems - Zalman - CPU cooling system CNPS80G REV.3, LGA1700, 1200, 115X, AM5, AM4, AM3+, AM3, TDP 65W

Zalman CPU cooling system CNPS80G REV.3, LGA1700, 1200, 115X, AM5, AM4, AM3+, AM3, TDP 65W

კოდი: CNPS80GREV.3
-უკან დაბრუნება
შემდეგი
ტექნიკური პარამეტრები Zalman CPU cooling system CNPS80G REV.3, LGA1700, 1200, 115X, AM5, AM4, AM3+, AM3, TDP 65W:
მთავარი მახასიათებლები
მთავარი მახასიათებლების სრული სია
Appointment for processor
A type Active cooler
The fans 1 pcs
Heatsink Material aluminum
Processor compatibility AM3+
AM3
AM4
LGA115X
LGA1200
LGA1700
AM5
Fan diameter mm 85
Bearing Type Long Life Bearing
Maximum speed, rev / min 2000
Max. air flow 27.18 CFM
The maximum TDP 65 W
Noise level 28 dB
Socket 4-pin
Main
Appointment for processor
A type Active cooler
Design
The fans 1 pcs
Heatsink Material aluminum
Processor compatibility AM3+
AM3
AM4
LGA115X
LGA1200
LGA1700
AM5
Fan
Fan diameter mm 85
Bearing Type Long Life Bearing
Maximum speed, rev / min 2000
Max. air flow 27.18 CFM
The maximum TDP 65 W
Static pressure 1.51 (мм H2O)
Physical
Noise level 28 dB
Socket 4-pin
Colour black
შეფუთვის პარამეტრები
სიგანე 130 მილიმეტრი
სიმაღლე 80 მილიმეტრი
სიგრძე 130 მილიმეტრი
წონა 0.27 კგ
მოცულობა 0.0014 მ3
გარანტია
გარანტია 12 თვე
Function: for processor; Type: Active cooler; Fan: 1 pcs; Radiator material: aluminum; Socket: AM3+, AM3, AM4, LGA115X, LGA1200, LGA1700, AM5; Fan diameter: 85; Bearing type: Long Life Bearing; Maximum rpm: 2000; Max. air flow: 27.18 CFM; Max TDP: 65 W; Power: 4-pin; Noise level: 28 dB;
27 ლარი*
ხელმისაწვდომია
 
* საშუალო ფასი ბაზარზე
Fully compatible with the latest high performance processors

It is fully compatible with the latest Intel's processors as well as AMD Ryzen. Power management technology for each processor is seamless, so you don't have to worry about compatibility issues.

Flower Heatsink (FHS) fin design for optimized performance

ZALMAN is the first in the world to introduce FHS (Flower Heatsink) technology by producing a three-dimensional radial shape fins throught the compression process of an aluminum plate. It features a wide heat dissipation structure compared to other compression type heatsink, and the heat generated from the CPU is evenly distributed throughout the heatsink which made it possible to achieve 65W TDP in a compact size.

Optimized design for maximized heat radiation area

1.5 heat radiation area compared to other same volume coolers. Top-Down Blowing design cools not only the CPU but also the other components arounf the CPU.

Compact Size

Eliminating installation constraints with its compact size.

Improving Performance with Ultra-Quiet 85mm PWM Fan

Optimized for FHS, the 85mm fan ensures maximum cooling performance. 85mm fan has PWM function to adjust the PRM according to the CPU temperature to achieve high performance/low noise.

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