Towards | gaming (overclocking) |
Form Factor | micro-ATX |
Connection type | LGA1700 |
Processor compatibility | Intel Core 13th Generation |
Intel Core 12th Generation | |
Intel Core 14th Generation | |
Northbridge (chipset) | Intel B760 |
UEFI BIOS | |
The maximum amount of memory | 192 GB |
Sound | 7.1 |
SATA3 (6 Gb / s) | 4 ports |
LAN (RJ-45) | 2.5 Gbps |
Wi-Fi | 6E (802.11 a/b/g/n/ac/ax) |
Bluetooth | v5.3 |
USB 2.0 | 6 pcs (4 задні, 2 передні роз'єми з підтримкою 4 додаткових USB 2.0 портів) |
Main power connector | 24-pin |
CPU Power | +8 /(+ 12 В) |
+4 /(+ 12 В) | |
Dimensions (HxW) | 244x244 mm |
Towards | gaming (overclocking) |
Form Factor | micro-ATX |
For processors | Intel |
Connection type | LGA1700 |
Processor compatibility | Intel Core 13th Generation |
Intel Core 12th Generation | |
Intel Core 14th Generation |
Northbridge (chipset) | Intel B760 |
BIOS | UEFI |
UEFI BIOS |
Connector type | DDR5 |
DDR5 | 4 slots |
Maximum operating frequency | 7800 MHz |
The maximum amount of memory | 192 GB |
Support for XMP |
Graphical interface | PCI-E x16 4.0 |
PCI-E x1 4.0 | |
PCI-E x16 5.0 | |
HDMI Output | |
Display Port |
Аudiochip | Realtek S1220A |
Sound | 7.1 |
Connection interface | SATA 3 |
M.2 | |
SATA3 (6 Gb / s) | 4 ports |
LAN (RJ-45) | 2.5 Gbps |
Number of LAN-ports | 1 |
LAN-Controller Model | Intel |
Wi-Fi | 6E (802.11 a/b/g/n/ac/ax) |
Bluetooth | v5.3 |
USB 2.0 | 6 pcs (4 задні, 2 передні роз'єми з підтримкою 4 додаткових USB 2.0 портів) |
USB | 16 pcs (9 задніх, 7 передніх) |
USB 3.2 Gen 1 | 4 |
USB 3.2 Gen 2 | 2 |
USB 3.2 Type-C | 5 pcs (1xGen 2x2 задній, 1xGen 1 задній, 1xGen 2 передній) |
M.2 connector | 2 |
Features | Extreme Engine Digi+ III |
Thermal sensor connector | |
S/PDIF out header | |
RGB Headers | |
CPU OPT Fan connector | |
AIO Pump header | |
CPU fan header | |
clear CMOS header | |
ROG DIMM.2 Module support | |
BIOS Flashback | |
Synchronization backlight Asus Aura Sync | |
GameFirst VI | |
Sonic Radar III | |
DTS® Sound Unbound | |
ROG CPU-Z | |
Sonic Studio III + Sonic Studio Virtual Mixer /+ Sonic Suite Companion | |
ASUS Q-Design | |
ASUS Thermal Solution | |
ASUS Exclusive Software | |
ASUS EZ DIY | |
Fan Xpert4 | |
Addressable Gen 2 header | |
AI Suite 3 | |
Front Panel Header | |
Extreme Engine Digi+ | |
Chassis Fan headers | |
Box Contains | SATA Cable /x2 |
User Manual | |
M.2 Rubber Package | |
Wi-Fi moving antenna | |
M.2 Q-Latch Package | |
Cable ties pack | |
ROG key chain | |
ROG Strix stickers | |
ROG Strix thank you card | |
Thermal pad for M.2 |
Main power connector | 24-pin |
CPU Power | +8 /(+ 12 В) |
+4 /(+ 12 В) | |
Dimensions (HxW) | 244x244 mm |
სიგანე | 70 მილიმეტრი |
სიმაღლე | 280 მილიმეტრი |
სიგრძე | 280 მილიმეტრი |
წონა | 1.79 კგ |
მოცულობა | 0.0055 მ3 |
გარანტია | 36 თვე |
A physical button unlocks the first PCIe slot’s security latch with one press, greatly simplifying the process of detaching a PCIe card from the motherboard when it’s time to upgrade to a new GPU or other compatible device.
M.2 Q-LATCH
The innovative Q-Latch makes it easy to install or remove an M.2 SSD without the need for specific tools. The design employs a simple locking mechanism to secure the drive and neatly eliminate traditional screws.
Four onboard LEDs indicate power status and identify problems with CPU, memory, graphics card, or boot device for quick diagnosis.
BIOS FLASHBACK
BIOS FlashBack is a safe and simple way to update BIOS. Just drop the (UEFI) BIOS file onto a FAT32-formatted USB stick, plug it into the USB BIOS FlashBack port, and press the button. Updates can even be performed without having memory or a CPU installed.
ALL-ROUND PERFORMANCE
Well-placed and optimized heatsinks cover the VRM and M.2 slots to keep performance pushed to the max, even in cramped quarters.
TEAMED POWER ARCHITECTURE
12 + 1 + 1 power stages each rated to handle up to 60A deliver ample current to drive the most powerful Intel 13th Gen processors through any workload with ease.
ALLOY CHOKES AND DURABLE CAPACITORS
High-end chokes and durable capacitors are engineered to resist extreme temperatures, enabling performance that exceeds industry standards.
SIX-LAYER PCB
A multi-layered printed circuit board design quickly dissipates heat around the voltage regulators to improve overall system stability.
OPTIMEM II
OptiMem II technology carefully maps memory signal pathways across different PCB layers to reduce path distance, and it adds shielding zones that significantly reduce crosstalk.
VRM HEATSINK ARRAY
Covering the power solution are two thick heatsinks with strategic airflow channels for increased heat dissipation while powering high-performance Intel 13th Gen processors.
LEADING CONNECTIVITY
The Strix B760-G D4 is entirely well-connected with high-speed wireless and wired networking, a plethora of USB I/O, and SupremeFX audio to pump crystal-clear sound through speakers or headphones for enhanced immersion.
PCIE PERFORMANCE
The top PCIe 5.0 x16 SafeSlot is well-equipped for the increased size and bandwidth of next-gen graphics cards. Zippy storage options abound with two PCIe 4.0 M.2 slots, all featuring robust heatsinks to maximize performance.
WIFI 6E
Onboard WiFi 6E technology takes advantage of newly available spectrum in the 6 GHz band to provide up to seven 160 MHz channels for ultrafast throughput and better performance in dense wireless environments.
Intel 2.5G Ethernet
Low-latency gaming, speedy file transfers, and high-resolution video streaming are among the many perks of onboard Intel 2.5 Gbps Ethernet.
SUPREMEFX
ROG SupremeFX is a unique blend of hardware and software technologies that provide superior audio. The Strix B760-G D4 implementation features the S1220A codec for high-resolution playback up to 32-bit/192 kHz across all channels. Front-panel output is streamed through the integrated Savitech amplifier that can drive high-fidelity acoustics to a wide variety of speakers and headsets.