| Appointment | for processor |
| A type | Active cooler |
| The fans | 1 pcs |
| Heatsink Material | aluminum |
| Processor compatibility | AMD AM3, AM3+, AM4, AM5 |
| LGA 1851, 1700, 1200, 1366, 115x | |
| Fan diameter, mm | 120 (120 x 120 x 25 мм) |
| Bearing Type | hydraulic |
| Maximum speed, rev / min | 800 - -2000+/-10% об/хв |
| Max. air flow | 21.5 CFM - 42.5 CFM |
| The maximum TDP | 130 W |
| Noise level | 13.5 dB - 35.2 дБ |
| Socket | 4-pin /PWM +5В 3 пін RGB Aura |
| Dimensions | 123 x 138 x 98 mm |
| The weight | 448 g |
| Appointment | for processor |
| A type | Active cooler |
| The fans | 1 pcs |
| Heat pipes | 4 pcs x 6 мм |
| Heatsink Material | aluminum |
| Processor compatibility | AMD AM3, AM3+, AM4, AM5 |
| LGA 1851, 1700, 1200, 1366, 115x |
| Fan diameter, mm | 120 (120 x 120 x 25 мм) |
| Bearing Type | hydraulic |
| Maximum speed, rev / min | 800 - -2000+/-10% об/хв |
| Max. air flow | 21.5 CFM - 42.5 CFM |
| The maximum TDP | 130 W |
| Backlighting |
вентилятор, RGB
|
| Rated voltage | 12 V |
| Rated current | 0.105 A - 0.215+/-10% A |
| Static pressure | 0.79+/-10% mm/H2O |
| Noise level | 13.5 dB - 35.2 дБ |
| Package contents | mounting kit |
| manual | |
| thermopaste | |
| fan | |
| Warranty card | |
| система охлаждения для процессора | |
| Socket | 4-pin /PWM +5В 3 пін RGB Aura |
| Dimensions | 123 x 138 x 98 mm |
| Colour | black |
| The weight | 448 g |
| სიგანე | 140 მილიმეტრი |
| სიმაღლე | 170 მილიმეტრი |
| სიგრძე | 140 მილიმეტრი |
| წონა | 0.67 კგ |
| მოცულობა | 0.0033 მ3 |
| გარანტია | 12 თვე |

Compatible with modern sockets Convenient fastening. Easy to install and disassemble.
LGA: 115X,1200,1366,1700
AMD: AM3,AM3+,AM4,AM5

Height 98 mm. The design does not interfere with the system components located on the motherboard. Heat dissipation rate from the processor surface: 130W.

It is possible to synchronize with the system light or turn it off.
120 mm fan – 4pin PWM/3pin +5VARGB

The compact tower form-factor of an aluminium radiator with a special black coating and ceramic particles, for active heat dissipation, provides effective cooling. Four copper 6 mm heat pipes are placed directly on the surface of the base, by the DTH technology of direct contact with the surface of the processor (Direct Touch Hitpipes).


Provides stable and quiet operation, does not overheat under high loads.

Manual
