Type of packaging | Box |
Connection | PCI-Express 5 |
The maximum resolution of the video card | 7680 x 4320 |
Cooling | active (cooler) |
3 вентилятора + радіатор | |
GPU Model | GeForce RTX 5070 |
Type of memory | GDDR7 |
Memory | 12 Gb |
Maximum GPU operating frequency | 2625 МГц /(MSI Center) |
2610 МГц /(Boost) | |
Скорость памяти | 28 Gbps |
Memory bus | 192 bit |
Power consumption | 250 V |
Graphics Card Type | Game |
Type of packaging | Box |
Connection | PCI-Express 5 |
The maximum resolution of the video card | 7680 x 4320 |
Is a slot | 2.5 |
HDCP |
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Utilities | G-SYNC technology |
Cooling | active (cooler) |
3 вентилятора + радіатор | |
Quantity of fans | 3 pcs |
GPU Model | GeForce RTX 5070 |
Type of memory | GDDR7 |
Memory | 12 Gb |
Maximum GPU operating frequency | 2625 МГц /(MSI Center) |
2610 МГц /(Boost) | |
Скорость памяти | 28 Gbps |
Memory bus | 192 bit |
Number of CUDA Cores | 6144 |
HDMI port | 1 pcs |
Ports DisplayPort | 3 pcs (v2.1b) |
External power connector | 1 x 16-pin |
DirectX version | 12 Ultimate |
OpenGL version | 4.6 |
Recommended power supply unit power, W | 650 |
Power consumption | 250 V |
The length of the video card | 338 mm |
Weight | 1187 g |
სიგანე | 410 მილიმეტრი |
სიმაღლე | 100 მილიმეტრი |
სიგრძე | 260 მილიმეტრი |
წონა | 1.70 კგ |
მოცულობა | 0.0107 მ3 |
გარანტია | 36 თვე |
Building on MSI's heritage, GAMING TRIO embodies the passion of gamers with a sleek exterior that erupts with vibrant lights amidst bold lines and sharp edges. LED lighting is diffused through a frosted cover and a dragon totem that radiate energy.
TRI FROZR 4 THERMAL DESIGN
Upgraded fans, improved airflow control, and advanced thermal innovations delivering superior
cooling and quieter operation that elevate the graphics card's overall performance.
YOUR SUPPORT CHARACTER
A bundled support stand can be attached to the PC case to hold up the graphics card.
ENHANCED EFFICIENCY DrMOS
DrMOS power stage solutions provide great efficiency with low power loss and enhanced voltage controls.
EFFECTIVE THERMAL PADDING
High-quality clay-based thermal pads offer additional heat dissipation for critical board components.